首页> 外文期刊>Research Disclosure >USING DYNAMIC CURRENT IN HOLLOW BEAM SEM TO IMPROVE VC INSPECTION
【24h】

USING DYNAMIC CURRENT IN HOLLOW BEAM SEM TO IMPROVE VC INSPECTION

机译:中空梁SEM中的动态电流提高VC检测

获取原文
获取原文并翻译 | 示例
           

摘要

A lilhographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of intcgrated circuits (ICs). Driven by the growing demand of manufacturing modern integrated circuits with ever shrinking sizes, lithographic technologies that can offer higher resolution and belter reliability are under a fasl-paced and extensive development. One of such advancing lithographic technologies is the extreme ultra-violet lithography (also known as EUV or EUVL). which allows for sub-10 nanometre (nm) scale resolution. In lilhographic processes, it is desirable frequently to make measurements of the structures created, e.g.. for process control and verification. Driven by such a demand, various inspection and metrology tools have been made available, including scanning electron microscopes (SEMs). which are often used to measure critical dimension (CD), and specialized optical metrology tools, such as various forms of scatleromelers. to measure overlay, a measure of ihc accuracy of alignment of two layers in a device. The basic principle of scanning electron microscopy is the scanning of an electron beam (e-beam) over a sample to build up an image. In order to boost the inspection speed and thus the Ihroughput. multiple beam c-hcam inspection (MBI) tools have been developed and are now commercially available.
机译:Lilhographogure设备是一种机器,该机器将所需图案施加到基板上,通常在基板的一部分上。例如,可以使用光刻设备,例如,在更换电路(IC)的制造中。由于生产现代集成电路的需求不断增长,可以提供更高分辨率和吹送者可靠性的平移技术受到Fasl节奏和广泛的发展。这种推进的平版技术之一是极端的超紫光刻(也称为EUV或EUV1)。这允许Sub-10纳米(NM)刻度分辨率。在Lilhographic过程中,希望经常理解,以进行创建的结构的测量,例如用于过程控制和验证。由这种需求驱动,已经提供了各种检验和计量工具,包括扫描电子显微镜(SEM)。这通常用于测量关键尺寸(CD)和专业的光学计量工具,例如各种形式的碎屑术。为了测量覆盖物,可以测量装置中两层对准的IHC精度。扫描电子显微镜的基本原理是在样品上扫描电子束(电子束)以构建图像。为了提高检查速度,从而提高Ihroughpul。已经开发了多个光束C-HCAM检查(MBI)工具,现在是商业上的。

著录项

  • 来源
    《Research Disclosure》 |2020年第674期|698-700|共3页
  • 作者

  • 作者单位
  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号