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Electrochemical behavior of Cu-Zn-Al shape memory alloy after surface modification by electroless plated Ni-P

机译:化学镀Ni-P表面改性后的Cu-Zn-Al形状记忆合金的电化学行为

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The electrochemical behavior of Cu-Zn-Al shape memory alloy (SMA) with and without electroless plated Ni-P was investigated by electrochemical methods, in artificial Tyrode's solution. The results showed that Cu-Zn-Al SMA engendered dezincification corrosion in Tyrode's solution. The anodic active current densities as well as electrochemical dissolution sensitivity of the electroless plated Ni-P Cu-Zn-Al SMA increased with NaCl concentration rising, pH of solution decreasing and environmental temperature uprising. X-ray diffraction analysis indicated that after surface modification by electroless plated Ni-P, an amorphous plated film formed on the surface of Cu-Zn-Al SMA. This film can effectively isolate matrix metal from corrosion media and significantly improve the electrochemical property of Cu-Zn-Al SMA in artificial Tyrode's solution.
机译:通过化学方法研究了在人工泰洛德溶液中有无化学镀Ni-P的Cu-Zn-Al形状记忆合金(SMA)的电化学行为。结果表明,Cu-Zn-Al SMA在蒂罗德溶液中引起脱锌腐蚀。随着NaCl浓度的增加,溶液的pH值的降低和环境温度的升高,化学镀Ni-P Cu-Zn-Al SMA的阳极活性电流密度和电化学溶解敏感性均增加。 X射线衍射分析表明,在通过化学镀Ni-P进行表面改性之后,在Cu-Zn-Al SMA表面上形成了非晶镀膜。该膜可以有效地将基体金属与腐蚀介质隔离,并显着提高在人工蒂罗德溶液中的Cu-Zn-Al SMA的电化学性能。

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