Improving Dry-Film Adhesion

摘要

Imaging yield is greatly influenced by the adhesion of dry film to the copper surface. Poor adhesion of dry film often causes cuts and shorts, especially with fine-pattern panels. In order to improve adhesion of dry film, a novel surface preparation chemistry was developed.A joint study was then conducted by MEC (Osaka, Japan) and Asahi Kasei (Tokyo, Japan) to determine the effectiveness of this new chemistry.