Avoiding the Pressure

摘要

In high-density designs active components are often placed on both sides of the circuit board. This makes installing through-hole components a challenge, particularly large connectors used for mating daughtercards to backplanes. Actives are often incompatible with wave soldering, and therefore must be protected by some type of board carrier fixture or shield. This can often be problematic due to the height of many common components and the resulting thickness of the carrier. Other options include hand soldering, which is not practical for large connectors, and special selective soldering equipment. Machines for selective soldering are typically expensive to buy and operate, and throughput can be a problem. Lower cost equipment is available, but is often limited in capability, not to mention operator-intensive.