As device supply voltages are reduced by IC vendors in search of lower power consumption, a PCB's very large scale integration (VLSI) power delivery routing solution plays an increasingly important role in enabling good signal integrity. Board-level VLSI devices requiring separate logic core and I/O supply levels are sometimes referred to as split-rail devices and are commonly available in high lead-count, fine-pitch BGA packages. Thorough planning is important when developing a BGA's PCB power routing solution.
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