首页> 外文期刊>Printed Circuit Design & Manufacture >Achieving High Density Designs Without Compromising Manufacturability
【24h】

Achieving High Density Designs Without Compromising Manufacturability

机译:在不影响可制造性的情况下实现高密度设计

获取原文
获取原文并翻译 | 示例
           

摘要

Today many designers are faced with trying to put more and more components in the same space of previously less dense assemblies. Knowing what the limits are means knowing what questions need to be asked to ensure the finished design will be buildable. There are many facets the designer needs to understand when trying to pack more in less space. They include component packaging, board size, land pattern design, spacing between components and, of course, the manufacturing equipment and process options, including testing. Too often one or more of these items are overlooked, resulting in escalated manufacturing costs or products that must be redesigned before they can be efficiently manufactured.
机译:如今,许多设计师正面临着将越来越多的组件放置在以前密度较小的组件的同一空间中的挑战。知道极限是什么,意味着知道需要问什么问题以确保完成的设计是可构建的。当试图在更少的空间内增加包装时,设计师需要了解许多方面。其中包括组件包装,电路板尺寸,焊盘图案设计,组件之间的间距,当然还包括制造设备和工艺选项,包括测试。这些项目中的一个或多个经常被忽略,导致制造成本上升,或者必须重新设计产品才能有效制造它们。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号