A 'Disconnection Approach' to Cleaning Process Selection

摘要

Post-Reflow Residues Of SnPb and newer Pb-free soldering materials are more difficult to remove due to increases in component density, larger component packages, higher lead counts, finer lead spacing and lower stand off distances. While modern aqueous alkaline cleaning agents effectively remove these flux residues, achieving satisfactory cleanliness depends on the interplay of temperature, exposure time, chemical concentration and mechanical energy.