Adiva (adiva.com) and Cadence (cadence,com) have signed a joint marketing agreement to offer a seamless process flow for validated PCB design.The companies said they would work together to address customer requirements for PCB designs that meet design, manufacturing and assembly requirements with higher first-pass yields. The effort will lead to improved front-end design validation, in which PCB tests are performed before a design is sent to be manufactured.IPC (ipc.org) released IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. The revision contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing,moisture-sensitive components, and microvia technology.
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