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"Novel Anisotropic Conductive Adhesive for 3D Stacking and Lead-Free PCB Packaging - A Review"Authors: S. Manian Ramkumar, et al; smrmet@ rit.edu.Abstract: In portable consumer products, while chip stacking via the system-in-package (SiP) approach is becoming quite popular, the use of conventional packaging techniques is complicated, and results in large parasitic inductances. The need for planarity, additional processing steps and high-temperature processing makes bumping and flip-chip bonding less than ideal. Conductive adhesives can be typically processed at a relatively low temperature, which is important for thermally sensitive components. This paper provides a summary of the research using a novel anisotropic conductive adhesive (ACA) for component level and Pb-free PCB-level packaging. (Electronic Components and Technology Conference, May-June, 2011)