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摘要

"Two Worlds Converging: Chipshooting and Flip chip Bonding" Authors: Eric Klaver and Patrick Huberts Abstract: Pick-and-place equipment has over the years mostly evolved in four key areas: It is faster, more reliable, more accurate and more user friendly. Most pick-and-place vendors have aimed at the mass production market, while others have moved toward more dedicated markets - mostly where production flexibility is needed, as with high-mix, prototyping or evaluation.