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"Package Substrate Advancements through Improved Adhesion of Electroless Copper to Dielectrics" Authors: Robin Taylor, Dr. Lutz Brandt, Dr. Zhiming Liu, Craig Rhodine and Tafadzwa Magaya; robin.taylor@atotech.com. Abstract: Fabrication of advanced package substrates is a relatively complex process, requiring numerous pretreatment, cleaning, surface preparation, deposition and rinsing steps. In most cases, metalizing a dielectric surface includes some form of activation or "seeding" process, followed by the autocatalytic (or "electroless") deposition of copper.