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摘要

"Evaluation of Solder Pastes for High Reliability Applications" Authors: Scott Anson, Ph.D., Michael McLaugh-lin, and Abner Argueta; scott.anson@rit.edu. Abstract: This study examined SnPb37 alloy with SnPb37 components and with SnAg3.0Cu0.5 (SAC 305) components for mixed-alloy reflow. Water-soluble and no-clean chemistries were evaluated. A design of experiments approach was employed to examine solder balling and slump resistance. Additional experiments examined print quality utilizing automated solder paste inspection (SPI) in terms of bridge resistance, CSP and 0201 insufficient resistance, and response to a 45-minute print pause. Assemblies were also built to check for yield, joint quality and voiding. The result is a holistic approach to solder paste testing that includes weighting of numerous factors to assess solder paste performance and robustness.