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摘要

Manufacturing the latest electronics designs requires printing ever-smaller deposits of solder paste. Once a critical stencil aperture aspect ratio is reached, other means of improving TE (transfer efficiency) must be investigated. A design of experiments was performed to show the effect of stencil nanocoatings on paste volumes and underscreen cleaning intervals. This paper describes the printing study, designed to highlight any improvement in TE by the use of nanocoatings on the stencil, and defines the best choice in factors, understanding their interaction with the product and process design. The testing employed one coating and different underscreen cleaning intervals. A PCB designed by Jabil, with OSP finish, was used as the test vehicle. (SMTA International, Sept. 28 - Oct. 2, 2014).