In Case You Missed It

摘要

"3D ICs with Self-Healing Capability for Thermal Effects in RF Circuits" Authors: Abhilash Goyal, Madhavan Swamina-than, Ph.D. and Abhijit Chatterjee, Ph.D.; Abstract: A self-healing methodology is proposed for designing 3D ICs with self-correctable circuits/ systems for heating effects. This methodology enables 3D ICs to work properly without designing/introducing sophisticated heat-removing capabilities around 3D ICs. The proposed methodology is independent of the kind of the circuit and process node technologies (CMOS or BJT). In the proposed methodology, temperature or heat around the circuit is monitored using an on-chip sensor. After sensing heat, the circuit is calibrated in the right direction to avoid performance degradation due to heating effects. The algorithm to calibrate the circuit is explained and, in addition, a very simple on-chip sensor presented to achieve the self-healing for heating effects. (15th International Symposium on Quality Electronic Design, March 2014).