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摘要

"Study of Thermally Enhanced 2.5D Packages with Multi-chips Molded on Silicon Interposer" Abstract: Thermally enhanced 2.5D package with exposed die is proposed, fabricated and examined from the thermal enhancement viewpoint. The high power thermal test die was first assembled on a silicon interposer with through silicon vias and connected to the substrate, which was followed by the overmold-ing and back-grinding processes to form the partially molded (PM) package with exposed die for direct heat sink attachments. Experiments were conducted to examine the thermal performance under different thermal conditions. Under natural convection without thermal enhancement, there was no performance difference between the PM package and the overmolded package. However, when the package top was mounted with a thermally enhanced structure such as a pin fin heatsink, the thermal resistance of the PM package was significantly reduced. The advantage was more prominent with the attachment of a high-performance liquid cooling heatsink. Thermal sim ulation models were also constructed to examine thermal performances under different test conditions, and the realistic thermal interface resistance of 0.5 Kcm~2/W was estimated based on the package warpage. The computed thermal resistances agreed with measurement results. (Journal of Electronic Materials, July 2015)