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Chemistry Preserves Signal Strength for High Frequency Applications

机译:化学试剂可保留高频应用的信号强度

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摘要

High-speed, high-frequency boards experience signal loss from micro-roughening trace profiles. Beta tests have now proved that FlatBOND GT, MEC's marquis copper surface treatment from Uyemura, forms a chemical bond that is superior in strength to any mechanical bond, and preserves transmission signal integrity. FlatBOND is the only product of its type, and is predicted to become the gold standard for multilayer adhesion. FlatBOND provides a profile-free surface, and improves adhesion by 40% on low dielectric resins.
机译:高速高频板会经历微粗糙痕迹轮廓的信号损失。 Beta测试现已证明,MEC的Uyemura侯爵的铜表面处理剂FlatBOND GT形成了化学键,其强度优于任何机械键,并保留了传输信号的完整性。 FlatBOND是同类产品中唯一的产品,并且有望成为多层粘合的金标准。 FlatBOND提供了无轮廓的表面,并且在低介电树脂上的粘合力提高了40%。

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