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摘要

Package technology has advanced significantly over the past several years, shifting from conventional components and direct board-level assembly to chip- or package-level system integration. Two major commonly used approaches are System-on-Chip (SoC) and System-in-Package (SiP). Package-on-Package (PoP) that integrates a processor in the bottom package and memory in the top package into a single 3D package is one of the promising SiP solutions. In addition to decreasing component pitch, utilization of the vertical space by stacking packages has found wide acceptance. Pb-free PoP technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile handheld electronics.