Another Big Shrink:Tiling Chiplets into Next-Generation Microsystems

摘要

By challenging the technology community to integrate the collective functions hosted by an entire PCB onto a device approaching the size of a single chip, Darpa's newest program is making a bid to usher in a fresh dimension of technology miniaturization. "We are trying to push the massive amount of integration you typically get on a printed circuit board down into an even more compact format," said Dr. Daniel Green, manager of the new program, whose acronym, "CHIPS," is itself a typographic feat of miniaturization; the program's full name is the Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies Program. "It's not just a fun acronym," Green said. "The program is all about devising a physical library of component chips, or chiplets, that we can assemble in a modular fashion."