The Dynamic Print Alignment Ecosystem

摘要

OURTEAM HAS been analyzing metric 0201s, work that really started to challenge the paste type and solder paste grain size. The exercise got me thinking about average particle ranges for various paste types and how that impacts aperture sizes and the machine specification for alignment. With printing, a successful outcome is all about various input interactions; it's not just one thing that influences a good, repeatable deposit. In the case of alignment accuracy, the diminishing solder paste particle range influences the stencil architecture, which then influences the amount of stencil-to-board gasketing and, of course, required machine alignment. I think of it as an ecosystem, with one element dependent on the other for a good outcome.