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摘要

In this work, a test methodology was developed for high-temperature isothermal shear fatigue of individual solder joints. Six solder alloys - five leadbased alloys and one lead-free alloy - were tested at 25° and 200℃. Joints tested at 200℃ were first stored at 200℃ for 1000 hr. to measure performance in a simulated high-temperature environment. The microstructure was studied in conjunction with the fatigue results to understand the structure-property-performance relationship. Results show those alloys with a dendritic structure had a greater characteristic life at room temperature. At 200℃ coarsening of the microstructures led to dramatically different results. (Journal of Surface Mount Technology, vol. 30, no. 2, June 2017)