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摘要

"Electrochemical Failures as a Function of Flux Volume under Bottom Terminated Components" Authors: Mark McMeen Abstract: The activity of flux residue changes when trapped under a low-profile leadless or bottom-terminated component. There are three factors to consider: 1) Standoff gap: lower-standoff gaps block out-gassing channels. Low-standoff gaps change the nature of the flux residue by leaving behind flux activators, solvents, and functional additives that normally would be outgassed from the residue; 2) Narrow pitch: miniaturized components have a decreased distance between conductors of opposite polarity. There is a higher potential to bridge conductors with flux residue; 3) Cubic volume of flux: increased I/O in combination with thermal lugs creates a higher cubic volume of flux left under the bottom termination. High flux volumes can block outgassing channels and bridge conductors.