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机译:市场观察

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1.PCB and MCM design software revenue fell 0.8% year-over-year to $292.9 million in the fourth quarter. (ESDA) 2.Sales at the top 50 EMS companies accounted for $384 billion in revenue, up 4.6% year-over-year, largely due to the top 10 EMS firms. (MMI) 3.Shipments of smart home devices, up 4.5% in 2020, will grow 12% per year over the next five years. (IDC) 4.North American electronics manufacturing orders in February rose 21.5% year-over-year and 16.7% sequentially. Shipments were up 6.4% compared to 2020. (IPC) 5.The global semiconductor industry is on track to register a rare three consecutive years of record highs in fab equipment spending, with a 16% increase in 2020, followed by forecast gains of 15.5% this year and 12% in 2022. (SEMI) 6.Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based CSPs. (Tech-search International) 7.German PCB manufacturers reported fourth quarter sales rose 1.7% from a year ago, bringing the full-year results to a loss of 9%. (ZVEI).
机译:1.PCB和MCM设计软件收入同比下降0.8%至第四季度的292.9百万美元。 (ESDA)2.前50家EMS公司的批次占收入3840亿美元,同比增长4.6%,主要是由于十大EMS公司。 (MMI)3.智能家居设备的船舶,2020年上涨4.5%,未来五年将每年增长12%。 (IDC)4. 2月份的美国电子制造订单同比增长21.5%,顺序增长16.7%。与2020年相比,出货量增加6.4%。(IPC)5。全球半导体行业正在轨道上以连续三年在FAB设备支出中登记罕见的历史新高,2020年增加了16%,其次是15.5的预测增益今年%和2022年的12%。(半)6.倒装芯片球网格阵列(FC-BGA)基板和基于层压板的CSP的容量保持紧固。 (Tech-Search International)7.German PCB制造商报告的第四季度销售额从一年前增加1.7%,使全年结果损失为9%。 (ZVEI)。

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    《Printed Circuit Design》 |2021年第5期|14-14|共1页
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