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PCB Design and Fabrication Concerns for MILLIMETER-WAVE CIRCUITS

机译:用于毫米波电路的PCB设计和制造问题

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摘要

Applications for millimeter-wave (mmWave) circuits are growing rapidly, from collision-avoidance radar systems in autonomous vehicles to high-data-rate fifth generation (g5G) new radio (NR) cellular wireless networks. Many such applications are driving higher frequencies, above 24GHz, where wavelengths are smaller and the smallest attention to circuit design and fabrication can make the biggest differences in electronic product performance. Understanding the differences between PCBs at mm Wave frequencies and lower frequencies can help avoid circuit manufacturing mishaps for many applications that are soon to require millions of double-sided and multilayer PCBs at those higher frequencies. Compared to lower frequency circuits, high-frequency RF/ microwave circuits are sensitive to circuit materials and fabrication processes. Whereas some electrical circuit functions such as power lines and digital control may be well-supported with low-cost FR-4 circuit materials, RF, microwave and mmWave circuits require much higher performance circuit materials to minimize signal losses and distortion. Many multilayer mixed-signal PCBs with many different electrical functions are a blend of different types of circuit substrate materials, with materials selected according to behavior best suited for the types of circuit functions fabricated on that layer.
机译:毫米波(MMWAVE)电路的应用迅速增长,从自动车辆中的碰撞雷达系统到高数据速率第五代(G5G)新的无线电(NR)蜂窝无线网络。许多这样的应用正在驾驶更高的频率,高于24GHz,其中波长较小,对电路设计和制造的最小关注可以使电子产品性能的最大差异成为最大的差异。了解MM波频率和较低频率的PCB之间的差异可以帮助避免在很快需要数百万个双面和多层PCB的许多应用中的电路制造不仅仅是在那些较高频率下的应用。与较低频率电路相比,高频RF /微波电路对电路材料和制造工艺敏感。虽然某些电路功能如电源线和数字控制,但具有低成本FR-4电路材料,RF,微波和MMWAVE电路需要更高的性能电路材料以最小化信号损失和失真。许多具有许多不同电力功能的多层混合信号PCB是不同类型的电路基板材料的混合物,根据最适合于在该层上制造的电路功能类型的行为选择的材料。

著录项

  • 来源
    《Printed Circuit Design》 |2021年第3期|28-35|共8页
  • 作者

    JOHN COONROD;

  • 作者单位

    Rogers Corp.;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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