Hensoldt, Nano Dimension 3-D Print 10-Layer PCB

摘要

Using a newly developed dielectric polymer ink and conductive ink from Nano Dimension, Hensoldt succeeded in using a 3-D printer to assemble a 10-layer PCB that carries high-performance electronic structures soldered to both outer sides. "Military sensor solutions require performance and reliability levels far above those of commercial components," said Thomas Miiller, CEO, Hensoldt. "To have high-density components quickly available with reduced effort by means of 3-D printing gives us a competitive edge in the development process of such high-end electronic systems." "Nano Dimension's relationship with Hensoldt is the type of partnership with customers we are striving for," said Yoav Stern, president and CEO, Nano Dimen-sion. "Working together and learning from Hensoldt led us to reach a first-of-its-kind in-depth knowledge of polymer materials applications. Additionally, it guided us in the development of Hi-PEDs (high-performance electronic devices) that create com-petitive edges by enabling unique implementations with shortest time to market." Hensoldt has used Nano Dimension's DragonFly 3-D printing system since 2016. Last year, Hensoldt implemented DragonFly Lights-Out Digital Manufacturing print-ing technology.