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摘要

"Qualification of High-Density Connector Solutions for Military and Avionic Environments" Authors: Kim Cho, Tim Pearson, David Hillman and Ross Wilcox; kimera.cho@collins.com. Abstract: This paper discusses the qualification of high-density connector solutions for rugged military and avionics environments. As electronic products have become progressively smaller in size, there has been a corresponding increase in the demand for miniature, electronic components and the development of high-density connectors. The consumer electronics industry has already implemented high-density connectors, while many avionics/military products still use traditional surface-mount and plated through-hole connectors. These traditional connectors are increasingly too large and cannot meet the signal capacity requirements of modern avionics/military product designs within the limited available printed circuit board space. In this study, two major types of high-density connectors, the fine-pitch leaded style and the area-array style, were installed on test boards using automated assembly with tin-lead and lead-free soldering processes. The assemblies were subjected to -55° to +125℃ thermal cycle testing in accordance with IPC-9701, Performance Tests Methods and Qualification Requirements for Surface Mount Solder Attachments. The first part of this paper discusses results and observations from the new testing of fine-pitch style and area-array style connectors. The second part of this paper compares data for the fine-pitch connectors to previously tested area-array connectors. Tradeoffs between these two types of connectors, including producibility, reliability, printed circuit board space usage, rework, ease of assembly, and defect identification, are discussed, (Collins company white paper, October 2019).