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Soluble polyimides based on a novel pyridine-containing diamine m,p-PAPP and various aromatic dianhydrides

机译:基于新型含吡啶的二胺m,p-PAPP和各种芳族二酐的可溶性聚酰亚胺

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摘要

A novel pyridine-containing aromatic diamine monomer, 4-phenyl-2,6-bis[3-(4-aminophenoxy)phenyl]pyridine (m,p-PAPP), was successfully synthesized by a modified Chichibabin reaction of benzaldehyde and a substituted acetophenone, 3-(4-nitrophenoxy)acetophenone (m,p-NPAP), followed by a reduction of the resulting dinitro compound 4-phenyl-2,6-bis[3-(4-nitrophenoxy)phenyl]pyridine (m,p-PNPP) with Pd/C and hydrazine monohydrate. The aromatic diamine was employed to synthesize a series of pyridine-containing polyimides (PIs) by polycondensation with various aromatic dianhydrides in N,N-dimethylformamide (DMF) via the conventional two-step method, and further thermal or chemical imidization forming PIs. The inherent viscosities of the resulting poly(amic acid)s and PIs were 0.59–0.73 and 0.56–0.68 dL/g; most of the PIs obtained by chemical imidization were readily soluble in common organic solvents such as DMF, N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidone (NMP), tetrahydrofuran (THF), etc. Meanwhile, strong and flexible PI films were obtained, which had good thermal stability, with the glass transition temperature (T g) of 204.5–237.4 °C and the temperature at 10% weight loss of 527.7–552.0 °C in nitrogen atmosphere, as well as outstanding mechanical properties with tensile strengths of 88.6–90.4 MPa, a tensile moduli of 1.04–1.56 GPa, and elongations at break of 7.2–8.7%. The PI films also were found to possess low water uptake of 0.89–0.98%.
机译:通过苯甲醛与取代基的Chichibabin修饰反应成功合成了一种新型的含吡啶的芳香族二胺单体4-苯基-2,6-双[3-(4-氨基苯氧基)苯基]吡啶(m,p-PAPP)。苯乙酮3-(4-硝基苯氧基)苯乙酮(m,p-NPAP),然后还原生成的二硝基化合物4-苯基-2,6-双[3-(4-硝基苯氧基)苯基]吡啶(m, p-PNPP)与Pd / C和一水合肼。芳族二胺通过常规的两步法,通过与各种芳族二酐在N,N-二甲基甲酰胺(DMF)中与各种芳族二酐缩聚,并进一步热或化学酰亚胺化形成PI,用于合成一系列含吡啶的聚酰亚胺(PI)。所得的聚酰胺酸和PI的固有粘度分别为0.59-0.73和0.56-0.68 dL / g。通过化学酰亚胺化获得的大多数PI易于溶于常见的有机溶剂,例如DMF,N,N-二甲基乙酰胺(DMAc),N-甲基-2-吡咯烷酮(NMP),四氢呋喃(THF)等。获得了具有良好热稳定性的柔性PI膜,在氮气气氛中玻璃化转变温度(T g )为204.5–237.4°C,失重10%时的温度为527.7–552.0°C,以及出色的机械性能,抗拉强度为88.6-90.4 MPa,拉伸模量为1.04-1.56 GPa,断裂伸长率为7.2-8.7%。还发现PI薄膜的吸水率低,为0.89–0.98%。

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  • 来源
    《Polymer Bulletin》 |2011年第9期|p.1191-1206|共16页
  • 作者单位

    Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional Materials, Hubei University, Wuhan, China;

    Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional Materials, Hubei University, Wuhan, China;

    Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional Materials, Hubei University, Wuhan, China;

    Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional Materials, Hubei University, Wuhan, China;

    Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional Materials, Hubei University, Wuhan, China;

    Ministry-of-Education Key Laboratory for the Green Preparation and Application of Functional Materials, Hubei University, Wuhan, China;

    Division of Spine Surgery, Department of Orthopaedics and Traumatology, The University;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Pyridine-containing diamine; Pyridine-containing polyimides; Solubility;

    机译:含吡啶的二胺;含吡啶的聚酰亚胺;溶解度;

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