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首页> 外文期刊>Plasma Chemistry and Plasma Processing >Chemical Vapor Deposition of Silicon Dioxide by Direct-Current Corona Discharges in Dry Air Containing Octamethylcyclotetrasiloxane Vapor: Measurement of the Deposition Rate
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Chemical Vapor Deposition of Silicon Dioxide by Direct-Current Corona Discharges in Dry Air Containing Octamethylcyclotetrasiloxane Vapor: Measurement of the Deposition Rate

机译:在含有八甲基环四硅氧烷蒸气的干燥空气中通过直流电晕放电对二氧化硅进行化学气相沉积:沉积速率的测量

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Experiments in a positive-polarity, wire/plate electrode establish the effects of the concentration of Octamethylcyclotetrasiloxane (150―1100 ppm) and the operating current (0.5―2.55 μA/cm length of wire) on the rate of deposition of silicon dioxide on the high voltage wire. The wire is 100 μm radius tungsten and the wire-to-plate spacing is 1.5 cm. Analyses of the deposit with X-ray diffraction, energy dispersive X-ray spectroscopy, and X-ray photoelectron spectroscopy show that it is amorphous silicon dioxide. The deposition rate increases linearly with increasing silicone concentration and corona current. For the concentrations of silicone likely to present in indoor air, the gas-phase processes limit the rate of deposition.
机译:在正极性线/板电极上进行的实验确定了八甲基环四硅氧烷的浓度(150-1100 ppm)和工作电流(0.5-2.55μA/ cm线长)对二氧化硅在硅片上的沉积速率的影响。高压线。导线为半径为100μm的钨,导线与板的间距为1.5 cm。 X射线衍射,能量色散X射线光谱和X射线光电子能谱对沉积物的分析表明,它是无定形二氧化硅。沉积速率随硅酮浓度和电晕电流的增加而线性增加。对于室内空气中可能存在的有机硅浓度而言,气相过程会限制沉积速率。

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