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Trap-Limited Vacancy Diffusion in Silicon at High Temperatures

机译:高温下陷阱陷阱的空位扩散。

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A high-temperature vacancy diffusivity (D-V) in silicon crystals is high and consistent with the extrapolated low-temperature diffusivity by Watkins. On the other hand, the apparent vacancy diffusivity in silicon wafers is significantly smaller than D-V. In particular, this has become more evident by recently reported vacancy-related donor profiles in high-resistivity wafers subjected to rapid thermal annealing (RTA). The reported donor depth profiles are complicated and strongly dependent on the RTA conditions. Yet, they are well reproduced, assuming that wafers (in contrast to the crystals) contain an appreciable amount of some impurity that acts as an efficient trap for vacancies even in a high-temperature range of RTA. The true vacancy diffusivity and the equilibrium ratio of the vacancy and self-interstitial concentrations are deduced from these data.
机译:硅晶体中的高温空位扩散率(D-V)高,与Watkins推断的低温扩散率一致。另一方面,硅晶片中的表观空位扩散率明显小于D-V。特别地,这通过最近报道的经受快速热退火(RTA)的高电阻率晶片中的空位相关的供体分布变得更加明显。报道的供体深度分布图很复杂,并且强烈依赖于RTA条件。但是,假设晶圆(与晶体相反)包含可观数量的某些杂质,即使在RTA的高温范围内,它们也可以有效地捕获空位,它们的复制效果很好。从这些数据推导出真实的空位扩散率以及空位和自填隙浓度的平衡比。

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