...
首页> 外文期刊>Optics and Lasers in Engineering >Processing of noised residual stress phase maps by using a 3D phase unwrapping algorithm
【24h】

Processing of noised residual stress phase maps by using a 3D phase unwrapping algorithm

机译:使用3D相位展开算法处理噪声残余应力相位图

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

The measurement of residual stress by using digital speckle pattern interferometry (DSPI) combined with the hole drilling technique is a valuable and fast tool for integrity evaluation of civil structures and mechanical parts. However, in some cases, measured phase maps are badly corrupted by noise which makes phase unwrapping a difficult and unsuccessful task. By following recommendations given by the ASTM E837 standard, 20 consecutive hole steps should be performed for the measurement of non-uniform stresses. As a consequence, 20 difference phase maps along the hole depth will be available for the DSPI technique. An adaptive phase unwrapping algorithm could be used in order to unwrap images following paths localized along well modulated pixels and performing two dimensional phase unwrapping (following paths inside a difference phase map corresponding to a hole step) or 3D phase unwrapping (similar to a temporal phase unwrapping following paths located at well-modulated pixels in a previous or a subsequent hole image). Non-corrupted and corrupted hole-drilling tests were processed with a traditional phase unwrapping algorithm as well as with the proposed 3D approach. Comparisons between unwrapped phase maps and simulated ones have shown that the proposed method gave results with best accordance than 2D results.
机译:通过使用数字散斑图案干涉术(DSPI)结合钻孔技术来测量残余应力,是用于评估民用结构和机械零件完整性的有价值且快速的工具。但是,在某些情况下,测量的相位图会被噪声严重破坏,这使相位展开变得困难而不成功。按照ASTM E837标准给出的建议,应执行20个连续的孔步骤以测量非均匀应力。结果,沿孔深度的20个差分相位图将可用于DSPI技术。可以使用自适应相位解包算法来解包图像,沿着经过良好调制的像素定位的路径进行图像解包,并执行二维相位解包(遵循与空穴步长相对应的差分相位图中的路径)或3D相位解包(类似于时间相位解开位于前一个或后一个孔图像中位于良好调制像素处的以下路径)。使用传统的相位展开算法以及建议的3D方法处理了未损坏和损坏的钻孔实验。展开相位图和模拟相位图之间的比较表明,与二维结果相比,该方法给出的结果具有最佳的一致性。

著录项

  • 来源
    《Optics and Lasers in Engineering》 |2013年第7期|890-897|共8页
  • 作者单位

    Laboratorio de Metrologia e Automatizafao, Universidade Federal de Santa Catarina, CEP 88040-970, Florianopolis, SC, Brazil;

    Laboratorio de Metrologia e Automatizafao, Universidade Federal de Santa Catarina, CEP 88040-970, Florianopolis, SC, Brazil;

    Laboratorio de Metrologia e Automatizafao, Universidade Federal de Santa Catarina, CEP 88040-970, Florianopolis, SC, Brazil;

    Laboratorio de Metrologia e Automatizafao, Universidade Federal de Santa Catarina, CEP 88040-970, Florianopolis, SC, Brazil;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    residual stress measurement; DSPI; Phase unwrapping; hole-drilling;

    机译:残余应力测量;DSPI;相位展开;打孔;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号