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Splicing of silica-based MOF and standard SMF: Loss evaluation using an enhanced field model

机译:硅基MOF和标准SMF的拼接:使用增强型场模型进行损耗评估

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摘要

Splice losses between the transmission optical fibers and the fiber-based devices have been considered as one of the bottlenecks in accomplishing the optical networks. Consequently, the practical utilization of specialty optical fibers such as triangular solid-core microstructured optical fibers (T-MOFs) in conjunction with splicing to dissimilar standard single-mode fiber (SMF) prerequisite a trustworthy, repeatable and robust low-loss splicing. Utilizing an enhanced field model, we appraised the splice losses between two similar T-MOFs without considering collapsing of air-holes at the joint interface with azimuthal and transverse offsets, and the splice loses between T-MOF and classical SMF are also explored. Collapsing of air-holes can facilitate to minimize the mode-profile inconsistency at splicing interface and hence, lowering the losses; therefore, we evaluated the mode-field diameter (MFD) as a function of collapse ratio. We reported splice losses of similar to 0.378 dB and similar to 5.032 dB at 1.55 mu m between two identical T-MOFs with A = 4.0 mu m, for the case of azimuthal and transverse offset, respectively. Also, we examined the consistency of our results by evaluating the relative errors, and the comparisons have been incorporated with those as reported in the literature.
机译:传输光纤和基于光纤的设备之间的熔接损耗已被视为实现光网络的瓶颈之一。因此,特殊光纤(如三角实心微结构光纤(T-MOF))的实际应用以及对不相同的标准单模光纤(SMF)的拼接,要求可信赖,可重复且坚固的低损耗拼接。利用增强的场模型,我们评估了两个相似的T-MOF之间的接头损耗,而没有考虑在具有方位角和横向偏移的接头界面处的气孔塌陷,并且还研究了T-MOF和经典SMF之间的接头损耗。气孔的塌陷可有助于最小化拼接界面处的模式轮廓不一致,从而降低损耗。因此,我们将模场直径(MFD)评估为坍塌比的函数。我们报告了两个相同的T-MOF在A = 4.0μm的情况下,分别在方位角偏移和横向偏移情况下,在1.55μm处的熔接损耗接近0.378 dB,类似于5.032 dB。此外,我们通过评估相对误差检查了结果的一致性,并将比较结果与文献报道的结果进行了比较。

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