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Tensile strength and failure behavior of bare single mode fibers

机译:裸单模光纤的拉伸强度和破坏行为

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摘要

We have investigated systematically the tensile strength and failure behavior of bare single mode fibers (SMFs) prepared by mechanical stripping technique. The tensile strength of bare SMFs under different temperatures is analyzed based on Weibull statistics. At room temperature, the bare SMFs show lower tensile strength than the SMFs with coating. The Weibull modulus referring to the width of the tensile strength distribution decreases when the gauge length of bare SMFs increases. The fractographic examination indicates that the fracture initiates from the outer cladding surface. As testing temperature increases from room temperature to 900 degrees C, we find that the tensile strength of bare SMFs decreases for the reason of the structural surface relaxation of SMF. The Weibull modulus decreases firstly then increases. Such change of bare SMFs is due to the partial restoration of flaws on fiber surfaces as testing temperature increases. The obtained results could provide guidance for the application of bare SMF prepared by mechanical stripping technique in harsh environment.
机译:我们已经系统地研究了通过机械剥离技术制备的裸单模光纤(SMF)的拉伸强度和破坏行为。根据威布尔统计数据,分析了不同温度下裸露的SMF的拉伸强度。在室温下,裸露的SMF表现出比带涂层的SMF更低的拉伸强度。当裸露的SMF的标称长度增加时,表示抗拉强度分布宽度的威布尔模量减小。断口检查表明,断裂始于外包层表面。随着测试温度从室温升高到900摄氏度,我们发现由于SMF的结构表面松弛,裸露SMF的拉伸强度降低。威布尔模量先下降然后增加。裸露的SMF的这种变化是由于随着测试温度的升高,纤维表面的缺陷得以部分恢复。所得结果可为通过机械剥离技术制备的裸露SMF在恶劣环境中的应用提供指导。

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