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Megapixel digital InSb detector for midwave infrared imaging

机译:用于中波红外成像的百万像素数字InSb检测器

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Since the late 1990s Semiconductor devices (SCDs) has developed and manufactured a variety of InSb two-dimensional (2D) focal plane arrays (FPAs) that were implemented in many infrared (IR) systems and applications. SCD routinely manufactures both analog and digital InSb FPAs with array formats of 320x256, 480×384, and 640x512 elements, and pitch size in the range 15 to 30 μm. These FPAs are available in many packaging configurations, including fully integrated detector-Dewar-cooler-assembly, with either closed-cycle Stirling or open-loop Joule-Thomson coolers. In response to a need for very high resolution midwave IR (MWIR) detectors and systems, SCD has developed a large format 2D InSb detector with 1280×1024 elements and pixel size of 15 μm. A digital readout integrated circuit (ROIC) is coupled by flip-chip bonding to the megapixel InSb array. The ROIC is fabricated in CMOS 0.18-μm technology, that enables the small pixel circuitry and relatively low power generation at the focal plane. The digital ROIC has an analog to digital (A/D) converter per-channel and allows for full frame readout at a rate of 100 Hz. Such on-chip A/D conversion eliminates the need for several A/D converters with fairly high power consumption at the system level. The digital readout, together with the InSb detector technology, lead to a wide linear dynamic range and low residual nonuniformity, which is stable over a long period of time following a nonuniformity correction procedure. A special Dewar was designed to withstand harsh environmental conditions while minimizing the contribution to the heat load of the detector. The Dewar together with the low power ROIC, enable a megapixel detector with overall low size, weight, and power with respect to comparable large format detectors. A variety of applications with this detector make use of different cold shields with different f-number and spectral filters. In this paper we present actual performance characteristics of the megapixel InSb detector and demonstrate its high manufacturability.
机译:自1990年代后期以来,半导体器件(SCD)已开发和制造了多种InSb二维(2D)焦平面阵列(FPA),这些阵列已在许多红外(IR)系统和应用中实现。 SCD通常会制造模拟和数字InSb FPA,其阵列格式为320x256、480×384和640x512元素,并且间距尺寸在15至30μm的范围内。这些FPA有多种包装配置,包括完全集成的探测器-杜瓦冷却器组件,以及闭环斯特林或开环焦耳-汤姆森冷却器。为了响应对非常高分辨率的中波IR(MWIR)检测器和系统的需求,SCD开发了一种大尺寸的2D InSb检测器,其像素为1280×1024,像素尺寸为15μm。数字读出集成电路(ROIC)通过倒装芯片键合耦合到百万像素InSb阵列。 ROIC采用CMOS0.18-μm技术制造,可实现小像素电路并在焦平面产生相对较低的功率。数字ROIC每通道具有一个模数(A / D)转换器,并允许以100 Hz的速率进行全帧读取。这种片上A / D转换无需在系统级使用多个功耗相当高的A / D转换器。数字读数与InSb检测器技术一起,可导致宽的线性动态范围和较低的残留不均匀性,在进行不均匀性校正程序后,其可长时间稳定。一种特殊的杜瓦瓶设计用于承受恶劣的环境条件,同时最大程度地减少了对探测器热负荷的影响。杜瓦瓶与低功耗的ROIC一起使百万像素检测器相对于同类的大幅面检测器而言总体上具有较小的尺寸,重量和功率。该探测器的各种应用都使用带有不同f值和光谱滤波器的不同冷屏。在本文中,我们介绍了百万像素InSb检测器的实际性能特征,并展示了其高可制造性。

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