机译:激光阵列封装中的TEC功耗
Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, Hubei, China;
Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, Hubei, China;
Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, Hubei, China,Wuhan Huagong Genuine Optics Tech Co., Ltd (HG Genuine), HUST Scien&Tech Park, East Lake Hi-Tech Zone, Wuhan, Hubei, China;
Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, Hubei, China;
TEC; Laser array; Thermal management; Semiconductor device packaging; FEM;
机译:基于AlGaAs的大功率二极管激光器阵列中封装引起的应变的弛豫
机译:大功率半导体激光二极管阵列封装的后冷式冲击冷却器的热特性
机译:使用REC技术封装和测试多波长DFB激光器阵列
机译:使用具有窄光谱的完全无铟封装技术的高功率二极管激光阵列开发
机译:高功率二极管激光器阵列的热管理,光束控制和封装设计,以及二极管激光器阵列抽运的棒状激光器的泵浦腔设计。
机译:设计制造和封装用于光遗传学应用的集成无线供电光极阵列
机译:用于泵送固态激光的高功率激光二极管阵列(2-D高功率LD阵列的开发)。