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首页> 外文期刊>NEC技報 >Development of Glass-ceramic Flat Plat Package Sealed by Lead-free Sealing Glass at 280 deg C
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Development of Glass-ceramic Flat Plat Package Sealed by Lead-free Sealing Glass at 280 deg C

机译:280℃下用无铅密封玻璃密封的玻璃陶瓷平板包装的开发

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摘要

NEC has developed a new glass-ceramic material for the flat package of crystal devices. As for hermetic sealing of the lid, NEC used the flit glass made material, but recently, for a viewpoint of environmental improvement, harmful materials such as lead are demanded to cut down its use. So NEC has developed the lead-free flit glass for hermetic sealing and applied to NEC's glass-ceramic flat package. NEC confirmed reliability of the lead-free sealing glass used for the flat package. This lead-free sealing glass can be sealed at 280 deg C, lower than current lead glass about 40~100 deg C. So NEC can make more efficient crystal devices using NEC's flat package sealed by the lead-free sealing glass.
机译:NEC已开发出一种新的玻璃陶瓷材料,用于晶体器件的扁平封装。关于盖的气密性,NEC使用了用碎玻璃制造的材料,但是最近,从改善环境的观点出发,要求减少铅等有害材料的使用。因此,NEC开发了用于密封的无铅玻璃料,并应用于NEC的玻璃陶瓷扁平封装。 NEC确认用于扁平包装的无铅密封玻璃的可靠性。这种无铅密封玻璃可以在280摄氏度下密封,比目前的铅玻璃低40到100摄氏度。因此,NEC使用NEC的无铅密封玻璃密封的扁平封装可以制造出效率更高的晶体器件。

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