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NDT-based design of joint material for the detection of bonding defects by infrared thermography

机译:基于NDT的接头材料设计,用于通过红外热像仪检测粘结缺陷

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摘要

Non Destructive Testing (NDT) by active InfraRed Thermography (IRT) of bonded Carbon Fibers Reinforced Plastic (CFRP) laminates is a very challenging issue. Difficulties come from the weak contrast between the thermal properties of constitutive parts, the small thickness of the epoxy joint and also the depth of the bonded interface. The strategy considered in this work is to design a new joint material specially adapted to the NDT detection of bonding defects. Using a numerical model, it is suggested to reinforce the epoxy joint material with conductive boron nitride particles. Experimental investigation of defective assemblies confirms the interest of such approach through a clear improvement of the IRT defect detection capacity.
机译:粘结碳纤维增强塑料(CFRP)层压板的主动红外热成像(IRT)进行无损检测(NDT)是一个非常具有挑战性的问题。难点在于,本构零件的热性能之间的对比度差,环氧树脂接缝的厚度小以及粘结界面的深度。这项工作考虑的策略是设计一种新的接头材料,该材料特别适合NDT检测粘结缺陷。使用数值模型,建议用导电氮化硼颗粒增强环氧接缝材料。对有缺陷的组件的实验研究通过明显改善IRT缺陷检测能力,证实了这种方法的重要性。

著录项

  • 来源
    《NDT & E international 》 |2018年第1期| 157-163| 共7页
  • 作者单位

    Institut Clement Ader (ICA), Univ. de Toulouse, CNRS, UT3, Toulouse, France,Laboratoire Genie de Production (LGP), INP-ENIT, Univ. de Toulouse, Tarbes, France;

    Laboratoire Genie de Production (LGP), INP-ENIT, Univ. de Toulouse, Tarbes, France;

    Laboratoire Genie de Production (LGP), INP-ENIT, Univ. de Toulouse, Tarbes, France;

    Institut Clement Ader (ICA), Univ. de Toulouse, CNRS, UT3,IUT de Tarbes, France;

    Institut Clement Ader (ICA), Univ. de Toulouse, CNRS, UT3,IUT de Tarbes, France;

    Institut Clement Ader (ICA), Univ. de Toulouse, CNRS, UT3, Toulouse, France;

    Institut Clement Ader (ICA), Univ. de Toulouse, CNRS, UT3, Toulouse, France;

    Composites Expertise & Solutions (CES), Castanet Tolosan, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    A. Polymer-matrix composites (PMCs); B. Thermal properties; C. Numerical analysis; D. Thermal analysis;

    机译:A.聚合物基复合材料(PMC);B.热性能;C.数值分析;D.热分析;

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