...
首页> 外文期刊>Microwave Journal >A VSAT PACKAGED HPA FOR GROUND TERMINAL AND DIGITAL RADIO APPLICATIONS
【24h】

A VSAT PACKAGED HPA FOR GROUND TERMINAL AND DIGITAL RADIO APPLICATIONS

机译:VSAT包装的HPA,用于地面终端和数字无线电应用

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

Two broadband satellite networks are in the final stages of development and plan a service launch for North America in early 2004. Systems like these are expected to provide wideband, high speed communications for Internet and multimedia applications across North America and Europe for years to come. High power ground terminals are required at each customer site to communicate with these satellite networks, and designers are searching for ways to reduce costs and increase efficiencies in on-going development programs. Low cost packaged high power amplifiers (HPA) at Ka-band are needed for emerging satellite ground terminal and millimeter-wave digital radio applications. Expensive hermetic packages will not meet the price point goals for these markets. The industry has instead searched for a simple, low cost packaged alternative that can be dropped into the RF module with minimal impact to assembly flow. The challenge is to provide a low cost MMIC with acceptable performance that can function in a cost-effective, Ka-band package environment. Such a single MMIC package solution will allow subsystem integrators to replace multi-chip modules now in use, thereby decreasing product complexity and cost.
机译:两个宽带卫星网络正处于开发的最后阶段,并计划在2004年初为北美推出服务。此类系统有望在未来几年内为北美和欧洲的Internet和多媒体应用提供宽带,高速通信。每个客户站点都需要大功率接地终端才能与这些卫星网络进行通信,设计人员正在寻找方法来降低成本并提高正在进行的开发程序的效率。新兴的卫星地面终端和毫米波数字无线电应用需要Ka波段的低成本封装高功率放大器(HPA)。昂贵的密封包装不能满足这些市场的价格目标。业界反而在寻找一种简单,低成本的封装替代方案,该替代方案可放入射频模块中,而对组装流程的影响最小。面临的挑战是提供一种具有可接受性能的低成本MMIC,使其能够在具有成本效益的Ka波段封装环境中运行。这种单一的MMIC封装解决方案将允许子系统集成商替换目前正在使用的多芯片模块,从而降低产品复杂性和成本。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号