APPLICATIONS OF CE ALLOYS IN DEFENSE, AEROSPACE, TELECOM AND OTHER ELECTRONIC MARKETS

摘要

The advantageous physical properties and manufacturing characteristics of Osprey Controlled Expansion (CE) alloys are currently being exploited in a variety of electronic applications. The ability to tailor the coefficient of thermal expansion (CTE) values of these alloys to ceramic circuit boards and components operating at high frequencies, combined with their lightness, high thermal conductivity, dimensional stability and manufacturability, have made them attractive for RF/microwave packages and carriers and also for heat sinks. The additional benefit of high stiffness has made the CE alloys with lower CTEs eminently suitable for optical and optoelectronic housings. On the other hand, the higher thermal expansion CE alloys are being increasingly used in carrier plates for laminate PCBs, guide-bars for circuit boards, and jigs and fixtures in semiconductor processing equipment and soldering ovens. This article considers how CE alloys offering these combinations of properties are being adopted for a growing range of applications.