PA Termination Impedance Selection Utilizing Temperature Contours

摘要

A PA design technique was presented, which focuses on control of device temperature rise by careful selection of the termination impedance. Thermal contours are assembled from conventional load pull data which is post processed. A measured 1.2 to 1.9rnGHz, 60 W amplifier design demonstrates correlation with the method. Circuit measurement and simulation with validation requires co-simulation with EM and modeling of all discrete elements.