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European Researchers Drive Semiconductor Technology

机译:欧洲研究人员推动半导体技术

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Europeans continue to rise to the challenge of advancing communication, imaging and radar integrated circuits to work at high frequencies. A team at In-teruniversitair Micro-Electronica Centrum Vzw (imec) in Belgium has developed the fT/fMAX 245/450 GHz SiGe:C heterojunction bipolar transistor - a sophisticated device that will help facilitate future high volume millimetre-wave low power circuits to be used in automotive radar applications. The study was funded in part by the Towards 0.5 terahertz silicon/germanium heterojunction bipolar technology (DOTFIVE) project, which received €9.7 M under the Information and Communication Technologies theme of the EU's Seventh Framework Programme (FP7). In order to secure the ultra-high speed requirements, sophisticated SiGe:C HBTs require additional upscaling of the device performance. For the most part, thin sub-collector doping profiles are considered a must for this upscaling. The collector dopants are typically introduced at the start of the process and are, therefore, exposed to the complete thermal budget of the process flow. Because of this, the accurate positioning of the buried collector is harder to obtain.
机译:欧洲人继续面临提高通信,成像和雷达集成电路在高频下工作的挑战。比利时大学微电子中心Vzw(imec)的团队开发了fT / fMAX 245/450 GHz SiGe:C异质结双极晶体管-一种复杂的器件,将有助于促进未来的大体积毫米波低功率电路的发展。用于汽车雷达应用。这项研究的部分资金来自于迈向0.5太赫兹硅/锗异质结双极技术(DOTFIVE)项目,该项目获得了欧盟第七框架计划(FP7)信息和通信技术主题下的970万欧元资助。为了满足超高速要求,复杂的SiGe:C HBT需要对设备性能进行额外的升级。在大多数情况下,薄的子集电极掺杂分布被认为是这种升级的必要条件。集电极掺杂剂通常在工艺开始时引入,因此暴露于工艺流程的全部热预算中。因此,难以获得掩埋收集器的精确定位。

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    《Microwave Journal 》 |2012年第1期| p.51| 共1页
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