Cost Effective 3D Glass Microfabrication for Advanced RF Packages

摘要

Microfabrication of glass micro-devices and circuits has been historically difficult at the part level, let alone in a high volume manufacturing (HVM) environment, due to low throughput, limited precision and accuracy, and reduced reliability, as well as limited process and design capabilities. A new photo-definable glass ceramic material has been developed that is processed in a three-step batch process enabling an HVM solution for glass microfabrication. Since the technology is based on a lithographic process, many design and process capabilities not typically associated with glass microfabrication are now possible, such as through glass vias (TGV)for I/Os, complex inductor line structures, high Q-factor architectures, and antenna air bridges on a single electrical substrate. The material's fine surface finish also enables an MCM capability with fully integrated thin film passive components such as resistors, capacitors and inductors.