Effective full 3D EMI analysis of complex PCBs by utilizing the latest advances in numerical methods combined with novel time-domain measurement technologies

摘要

A multilayer PCB board developed for a mobile phone by a leading technology company was CAD-imported and numerically assessed using the EM simulation platform SEMCAD X. A detailed characterization of the board level coupling, field distribution and radiation behavior was achieved through comprehensive simulations. The simulation results of the relative isolation recorded at the 3 victim ports agree well with experimental results for the 3 different shielding configurations. Furthermore, a simplified PCB model with transmission line analysis was used to elaborate on the differences observed in specific configurations, namely the Victim 2 and 3 isolations for the no shielding case.