首页> 外文期刊>IEEE microwave and wireless components letters >A 20 to 24 GHz $+$16.8 dBm Fully Integrated Power Amplifier Using 0.18 $mu{rm m}$ CMOS Process
【24h】

A 20 to 24 GHz $+$16.8 dBm Fully Integrated Power Amplifier Using 0.18 $mu{rm m}$ CMOS Process

机译:使用0.18 $ mu {rm m} $ CMOS工艺的20至24 GHz $ + $ 16.8 dBm全集成功率放大器

获取原文
获取原文并翻译 | 示例
           

摘要

A 20-24 GHz, fully integrated power amplifier (PA) with on-chip input and output matching is realized in 0.18 mum standard CMOS process. By cascading two cascode stages, the PA achieves 15 dB small signal gain, 10.7% power added efficiency, 16.8 dBm output saturation power and high power density per chip area of 0.137 W/mm2, which is believed to be the highest power density to our knowledge. The whole chip area with pads is 0.35 mm2, which is the smallest one compared to all reported paper.
机译:具有0.18mm标准CMOS工艺的具有片内输入和输出匹配的20-24 GHz,全集成功率放大器(PA)。通过级联两个共源共栅级,PA可实现15 dB的小信号增益,10.7%的功率附加效率,16.8 dBm的输出饱和功率和每芯片面积0.137 W / mm2的高功率密度,这被认为是我们最高的功率密度知识。带焊盘的整个芯片面积为0.35 mm2,是与所有报告的纸张相比最小的面积。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号