Electromechanical property characterisation of three-dimensional helical nanobelts by in situ gold nanoink soldering

摘要

The authors report gold nanoink-based in situ scanning electron microscope (SEM) compatible nanosoldering technique to interconnect threedimensionalnthin-film nanostructures and electrodes for their assembly of nanoelectromechanical systems. Helical nanobelts are placed onto asfabricatedngold electrodes using nanomanipulation inside a SEM then deposited with gold nanoink to improve the electrical conductivity andnmechanical stability. Electromechanical characterisations of helical nanobelts and nanowires reveal the reduced contact resistance andnmechanically strong assembly. It is promising to the application of prototype device assembly and manipulations of various nanostructures.