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Bonding Interface Formation between Mg Alloy and Steel by Liquid-phase Bonding using the Ag Interlayer

机译:Ag中间层通过液相键合形成镁合金与钢之间的键合界面

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Liquid-phase bonding between a Mg alloy (AZ31) and low-carbon steel was attempted at 773 K (500 °C) using Ag as an interlayer that forms a eutectic melt with the Mg alloy at this temperature. On the AZ31 side, eutectic melting and subsequent isothermal solidification were observed, and it was confirmed that the solidification of the eutectic liquid was promoted by the diffusion of Ag into the AZ31 base metal. On the steel side, Al was transported from AZ31 during the eutectic melting and isothermal solidification. This transported Al was enriched at the steel surface and reacted with steel to form a uniform, thin Fe-Al intermetallic compound layer. After the isothermal solidification, strong bonding was achieved via the thin intermetallic compound layer between AZ31 and steel, and no Ag remained at the bonding interface. The strength of the joint was found to be higher than the yield strength of AZ31.
机译:Mg合金(AZ31)和低碳钢之间的液相键合尝试使用Ag作为中间层,在此温度下,Ag与Mg合金形成共晶熔体,从而在773 K(500°C)下进行。在AZ31侧,观察到共晶熔化和随后的等温凝固,并且证实了通过Ag扩散到AZ31母材中促进了共晶液体的凝固。在钢方面,在共晶熔化和等温凝固过程中,Al从AZ31运出。所输送的Al在钢表面富集,并与钢反应形成均匀,薄的Fe-Al金属间化合物层。等温凝固后,通过AZ31和钢之间的薄金属间化合物层实现了牢固的结合,并且在结合界面上没有残留Ag。发现接头的强度高于AZ31的屈服强度。

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