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Physical modeling of Fermi-level effects for decanano device process simulations

机译:费米能级效应的物理建模,用于decanano器件过程仿真

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We report on a physically based Fermi-level modeling approach designed to be accurate and yet amenable to be implemented in a device-size process simulator. We use an atomistic kinetic Monte Carlo method in conjunction with a continuum treatment for carrier densities. The model includes: (ⅰ) charge reactions and electric bias according to the local Fermi-level; (ⅱ) pairing and break-up reactions involving charged particles; (ⅲ) clustering-related dopant deactivation; and (ⅳ) Fermi level-dependent solubility. Degenerated statistics, band-gap narrowing, and damage-induced electrical compensation are also included. The parameters used for charged particles are in agreement with ab initio calculations and experimental results. This modeling scheme has proved to be very computationally efficient for realistic device-dimension process simulations. We present an illustrative set of simulation results for two common dopants, boron and arsenic, and discuss the potential of this approach for accurate process simulation of decanano CMOS devices.
机译:我们报告了一种基于物理的费米级建模方法,该方法旨在准确且可在设备尺寸的过程模拟器中实施。我们将原子动力学蒙特卡罗方法与载流子密度的连续处理结合使用。该模型包括:(ⅰ)根据局部费米能级的电荷反应和电偏压; (ⅱ)涉及带电粒子的配对和分解反应; (ⅲ)与团簇有关的掺杂剂失活; (ⅳ)费米能级依赖性的溶解度。还包括退化统计数据,带隙变窄以及损伤引起的电补偿。用于带电粒子的参数与从头算和实验结果一致。对于实际的设备尺寸过程仿真,该建模方案已证明在计算上非常有效。我们为两种常见的掺杂剂硼和砷提供了一组说明性的仿真结果,并讨论了这种方法对decanano CMOS器件进行精确工艺仿真的潜力。

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