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Effect of scratching speed on phase transformations in high-speed scratching of monocrystalline silicon

机译:刮擦速度对单晶硅高速刮擦中相变的影响

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摘要

This paper investigates the phase transformation of (100) monocrystalline silicon in high-speed scratching tests. Various phase transformations of silicon are detected using micro-Raman spectroscopy over a wide range of speeds from 1 mm/min to 25 m/s. Wurtzite silicon (Si-IV) phase with strong Raman intensity is observed in all scratches. The Raman intensity ratio of amorphous silicon to Si-IV in the scratched groove center increases exponentially beyond a scratching speed of 105 mm/min, resulting in a decreased residual scratched depth. The tests provide a basic understanding of the effect of scratching speed on the phase transformation of silicon.
机译:本文研究了高速划痕测试中(100)单晶硅的相变。使用显微拉曼光谱法可以在1 mm / min至25 m / s的速度范围内检测硅的各种相变。在所有划痕中均观察到拉曼强度高的纤锌矿硅(Si-IV)相。划痕沟槽中心处的非晶硅与Si-IV的拉曼强度比呈指数增长,超过了105 mm / min的划痕速度,导致残留的划痕深度减小。这些测试提供了对刮擦速度对硅相变影响的基本了解。

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