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Creep properties of single crystal Ni-base superalloys (SX): A comparison between conventionally cast and additive manufactured CMSX-4 materials

机译:单晶镍基高温合金(SX)的蠕变特性:常规铸造和增材制造的CMSX-4材料之间的比较

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摘要

The present work compares the microstructures and the creep properties of two types of single crystal Ni-base superalloy CMSX-4 materials (SXs). One was produced by conventional directional solidification Bridgman processing. The other was manufactured by selective electron beam melting (SEBM). The microstructures of the two types of materials are compared with emphasis placed on the large (dendritic/interdendritic regions) and small scale (gamma-matrix/gamma'-precipitates) microstructural heterogeneities, which characterize SX microstructures and their evolution during processing, heat treatment and creep. It is shown that heat treated SEBM materials have creep properties, which match or even outperform those of conventionally processed SX materials. Creep properties were assessed using a miniature creep test technique where [001] miniature tensile creep specimens were tested in the high temperature/low stress (1050 degrees C, 160 MPa) and in the low temperature/high stress (850 degrees C, 600 MPa) creep regimes. The creep behavior is interpreted based on microstructural results, which were obtained using analytical scanning and transmission electron microscopy (SEM and TEM).
机译:本工作比较了两种类型的单晶镍基高温合金CMSX-4材料(SXs)的微观结构和蠕变性能。一种是通过常规的定向凝固Bridgman工艺生产的。另一个是通过选择性电子束熔化(SEBM)制造的。比较了两种类型材料的微观结构,重点放在了大(树枝状/树枝状区域)和小规模(γ-基体/γ'-沉淀)微观结构的异质性上,这些异质性表征了SX微观结构及其在加工,热处理过程中的演变。和蠕变。结果表明,经热处理的SEBM材料具有蠕变性能,该蠕变性能与常规加工的SX材料相匹配甚至优于其性能。使用微型蠕变测试技术评估了蠕变特性,其中在高温/低应力(1050摄氏度,160 MPa)和低温/高应力(850摄氏度,600 MPa)中测试了[001]微型拉伸蠕变样品)蠕变状态。蠕变行为基于微观结构结果来解释,该结果是使用分析扫描和透射电子显微镜(SEM和TEM)获得的。

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