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机译:纳米压痕法研究Ag纳米粒子改性石墨烯/ Sn-Ag-Cu焊料的力学性能
Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;
Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;
Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;
Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;
Singapore Inst Mfg Technol, 71 Nanyang Dr, Singapore, Singapore;
Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;
Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;
Composite solders; Reinforcement; Ball milling method; Nanoindentation; Creep model;
机译:纳米茚满的Ag纳米粒子改性石墨烯/ Sn-Ag-Cu焊料的力学性能研究
机译:Ag纳米粒子修饰的石墨烯/ Sn-Ag-Cu / Cu焊点的修正本构模型
机译:缩进尺寸对Ag纳米粒子改性石墨烯/ Sn-Ag-Cu焊料的影响
机译:纳米压痕在锡-银-铜焊料机械性能和可靠性评估中的应用
机译:电子封装应用中的Sn-Ag-Cu无铅焊料的机械性能和微观结构研究。
机译:石墨烯纳米片对Sn-20Bi-XGNS / Cu焊点润湿性和力学性能的影响
机译:PB焊料和Sn-Ag-Cu系列焊料合金焊接性能与机械热疲劳性能的比较。