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首页> 外文期刊>Materials Science and Engineering >Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation
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Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation

机译:纳米压痕法研究Ag纳米粒子改性石墨烯/ Sn-Ag-Cu焊料的力学性能

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摘要

In this study, mechanical mixing and ball milling were used to mix a variety of different mass fractions of Ag nanoparticle-modified graphene nanosheets (Ag-GNSs) and Sn-Ag-Cu solder alloys to form composite solder alloys. We found that the latter was superior to the former, as the ball-milled samples showed better mechanical properties through nanoindentation tests. The mechanical properties of solder alloys reinforced with Ag-GNSs were compared with those reinforced with unmodified GNSs, and we found that Ag-GNSs were more beneficial for reinforcement. When the amount of Ag-GNSs increased, the composite solders showed improved Young's modulus, hardness, and creep resistance with the exception of 0.2 wt%. The indentation morphologies were observed by scanning electron microscope (SEM), while the microstructure of the composite solder alloys were analyzed by transmission electron microscope (TEM) and electron back scattering diffraction (EBSD). Due to grain boundary and dislocation strengthening, the mechanical properties of the composite solder alloys have been improved. A modified constitutive creep model considering microstructural strengthening showed great agreement with the experiment data.
机译:在这项研究中,使用机械混合和球磨将各种不同质量分数的Ag纳米粒子改性的石墨烯纳米片(Ag-GNSs)和Sn-Ag-Cu焊料合金混合以形成复合焊料合金。我们发现后者优于前者,因为通过纳米压痕测试,球磨样品显示出更好的机械性能。比较了用Ag-GNS增强的焊料合金的机械性能和用未改性的GNS增强的焊料合金的机械性能,我们发现Ag-GNS对增强更有利。当Ag-GNSs的量增加时,除了0.2wt%之外,复合焊料显示出改善的杨氏模量,硬度和抗蠕变性。用扫描电子显微镜(SEM)观察压痕的形貌,用透射电子显微镜(TEM)和电子背散射衍射(EBSD)分析复合焊料合金的显微组织。由于晶界和位错的加强,复合焊料合金的机械性能得到了改善。考虑微观结构强化的改进本构蠕变模型与实验数据吻合良好。

著录项

  • 来源
    《Materials Science and Engineering》 |2019年第22期|138051.1-138051.13|共13页
  • 作者单位

    Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;

    Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;

    Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;

    Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;

    Singapore Inst Mfg Technol, 71 Nanyang Dr, Singapore, Singapore;

    Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;

    Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China|Tianjin Key Lab Adv Joining Technol, Tianjin 300350, Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Composite solders; Reinforcement; Ball milling method; Nanoindentation; Creep model;

    机译:复合焊料;增强;球磨法;纳米压痕;蠕变模型;

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