Non-destructive evaluation of shoes bonded area defect applying ultrasound infrared thermography technique and finite element analysis

摘要

The infrared (IR) thermography technique is being applied in many areas. Particularly these days,nnon-destructive inspection and evaluation using the ultrasound IR thermography technique arenthe focus in a wide range of study areas. The ultrasound IR thermography technique uses thenprinciple that ultrasound waves projected to objects with cracks or defects at connectionsngenerate local heat from the defective surface. The most important cause of defects in shoes isnthe decrease in strength due to delamination in bonding. The most serious defect is the bondingndefect between the outer cover and the sole of shoes, which was determined only now throughnvisual inspection. In this research, non-destructive evaluation method is introduced for totalninspection of special shoes applying ultrasound IR thermography technique. Performance of thenproposed method is shown by thermo-imaging and confirmed through finite element analysis ofnCOMSOL Multiphysic. The total inspection system using IR thermal camera for special shoes, itsnapplicability, and system configuration are introduced.