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Comparison of microstructure and mechanical properties of pure copper processed by twist extrusion and equal channel angular Pressing

机译:扭曲挤压和等通道转角挤压纯铜的显微组织和力学性能比较

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摘要

Commercially pure copper sample was subjected to severe plastic deformation (SPD) processing via applying twist extrusion (TB) and equal channel angular pressing (ECAP) at room temperature. It was found that in the same accumulated strain (similar to 2.4), TB decreased the mean grain size more than ECAP did. Moreover, the microstructure produced by TE was more homogeneous than that obtained by ECAP. The results of the tensile test showed that the strength properties of the TEed sample were higher than those of the ECAPed one. However, in the same strain value the ductility of the ECAPed specimen was higher than that of the TEed sample. (C) 2015 Elsevier B.V. All rights reserved.
机译:通过在室温下施加扭曲挤压(TB)和等通道角向挤压(ECAP),对商业纯铜样品进行了严重的塑性变形(SPD)处理。发现在相同的累积应变(类似于2.4)下,TB比ECAP减小的平均晶粒尺寸更大。而且,TE产生的显微组织比ECAP更为均匀。拉伸试验的结果表明,TEed样品的强度性能高于ECAPed样品。但是,在相同的应变值下,ECAPed试样的延展性高于TEed试样的延展性。 (C)2015 Elsevier B.V.保留所有权利。

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